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05138 SMF05C thru Only One Name Means ProT ek'TionTM SMF24C ST ANDARD CAPACIT ANCE TVS ARRA Y APPLICA TIONS Notebook Computers Cellular Phone Base Stations Personnal Digital Assistant (PDA) Digital Cameras IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FEA TURES 100 Watts Peak Pulse Power per Line (tp=8/20s) Monolithic Design Available in Multiple Voltage Types Ranging From 5V to 24V Protect 4 Lines Bidirectional and 5 Lines Unidirectional ESD Protection > 25 kilovolts Low Clamping Voltage RoHS Compliant in Lead-Free Versions MECHANICAL CHARACTERISTICS Molded JEDEC SC-70-6L Package Weight 7 milligrams (Approximate) Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed) Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245C Pure-Tin - Sn, 100: 260-270C Flammability rating UL 94V-0 8mm Tape and Reel Per EIA Standard 481 Marking: Marking Code & Pin One Defined By DOT on Package SC-70-6L PIN CONFIGURA TIONS 1 2 3 6 5 4 05138.R8 6/05 1 www.protekdevices.com SMF05C thru SMF24C DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified PARAMETER Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature SYMBOL PPP TJ TSTG VALUE 100 -55C to 150C -55C to 150C UNITS Watts C C ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified PART NUMBER DEVICE MARKING RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 5A VC VOLTS 9.8 MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE (See Note 1) VWM VOLTS SMF05C SMF12C SMF15C SMF24C 05C 12C 15C 24C 5.0 12.0 15.0 24.0 @ 1mA V(BR) VOLTS 6.0 13.3 16.7 26.7 @8/20s VC @ IPP 12.0V @ 9.0A 23.8V @ 4.2A 33.3V @ 3.0A 55.5V @ 1.8A @VWM ID A 5 1 1 1 @0V, 1 MHz CJ pF 60 30 25 20 Note 1: Pins 1, 3, 4, 5 or 6 to pin 2. 10,000 PPP - Peak Pulse Power - Watts FIGURE 1 PEAK PULSE POWER VS PULSE TIME IPP - Peak Pulse Current - % of IPP 120 100 80 60 40 20 0 tf FIGURE 2 PULSE WAVE FORM Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s 1,000 e-t 100W 8/20s Waveform 100 td = t I /2 PP 10 0.1 1 10 100 td - Pulse Duration - s 1,000 10,000 0 5 10 15 t - Time - s 20 25 30 05138.R8 6/05 2 www.protekdevices.com SMF05C thru SMF24C GRAPHS FIGURE 3 POWER DERATING CURVE Peak Pulse Power 8/20s 100 80 % Of Rated Power 60 40 20 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - C 150 16 VC - Clamping Voltage - Volts FIGURE 4 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT 12 8 4 0 0 2 4 6 IPP - Peak Pulse Current - Amps 8 10 05138.R8 6/05 3 www.protekdevices.com SMF05C thru SMF24C APPLICA TION NOTE The SMFC Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD or EFT. This product provides both unidirectional and bidirectional protection, with a surge capability of 100 Watts PPP per line for an 8/20s waveshape and ESD protection > 25 kilovolts. UNIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 1) The SMFC Series provides up to four (4) lines of protection in a common-mode configuration as depicted in Figure 1. Circuit connectivity is as follows: Figure 1 - Unidirectional Configuration Common-Mode I/O Port Protection Line 1 is connected to Pin 1. Line 2 is connected to Pin 3. Line 3 is connected to Pin 4. Line 4 is connected to Pin 6. Pin 2 is connected to ground. I/O PORT LINE 1 LINE 2 3 2 1 BIDIRECTIONAL DIFFERENTIAL-MODE CONFIGURATION (Figure 2) The SMFC Series provides up to five (5) lines of protection in a differential-mode configuration as depicted in Figure 2. Circuit connectivity is as follows: Line 1 is connected to Pin 1. Line 2 is connected to Pin 3. Line 3 is connected to Pin 4. Line 4 is connected to Pin 5. Line 5 is connected to Pin 6. Pin 2 is not connected. 4 5 6 LINE 3 LINE 4 CIRCUIT BOARD LAYOUT RECOMMENDATIONS Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are recommended: Figure 2 - Bidirectional Configuration Differential-Mode I/O Port Protection The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. The path length between the TVS device and the protected line should be minimized. All conductive loops including power and ground loops should be minimized. The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. I/O PORT LINE 1 LINE 2 3 2 1 4 5 6 LINE 3 LINE 4 LINE 5 05138.R8 6/05 4 www.protekdevices.com SMF05C thru SMF24C PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE D E SC70-6L 6 5 4 K 0 - 8 PACKAGE DIMENSIONS DIM MILLIMETERS MIN MAX 1.90 1.15 0.80 0.15 0.65 BSC 1.30 BSC 0.80 0.08 2.00 0 0.26 2.15 1.35 1.00 0.30 1.10 0.25 2.20 0.10 0.46 3 2 1 L J B M INCHES MIN MAX 0.074 0.045 0.031 0.006 0.0255 BSC 0.0512 BSC 0.031 0.003 0.078 0 0.010 0.084 0.055 0.040 0.012 0.043 0.010 0.086 0.004 0.018 F A G C A B C D E F G J K L M NOTES MOUNTING PAD TYPICAL DIM Millimeters Inches 1 2 3 4 5 6 7 0.50 1.30 0.65 1.72 0.60 1.11 2.33 0.020 0.051 0.026 0.068 0.024 0.044 0.092 4 1. Dimensioning and tolerances per ANSI Y14.5M, 1985. 2. Controlling Dimension: Inches 3. Dimensions are exclusive of mold flash and metal burrs. 3 2 1 5 6 7 TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA-481. 2. Suffix-T7 = 7 Inch Reel - 3,000 pieces per 8mm tape, i.e., SMF005C-T7. 3. Suffix-LF = Lead-Free, Pure Tin Plating, i.e., SMF05C-LF-T7. Outline & Dimensions: Rev 3 - 9/05, 06019 Tape & Reel Specifications (Dimensions in millimeters) Reel Dia. 178mm (7") Tape Width 8mm A0 B0 K0 D E F W P0 P2 P tmax 0.25 2.25 0.10 2.34 0.10 1.22 0.10 1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05 4.00 0.10 P0 t D P2 10 Pitches Cumulative Tolerance on Tape. 0.2 E Top cover tape A0 K0 B0 Pin 1 Indicated by Dot F W P User Direction of Feed COPYRIGHT (c) ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com 05138.R8 6/05 5 www.protekdevices.com |
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